On February 26, 2019, at the next conference day of the « Rencontres de génie, Genium 360 », several experts and entrepreneurs will gather to present how the 4th industrial revolution is reinventing business models. Catherine Bouchard, president of Centris Technologies, will present at 10:45 the conference “Implementation of a vertical integration system: comparison of impacts on …
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As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have propelled the first comprehensive redesign of the silicon etch chamber in over a decade. The resulting Applied Centris Sym3 system delivers world-class cross-wafer uniformity with unprecedented within-chip feature control in critical etch applications for high-volume manufacturing at the 1x/10nm node and beyond.
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