As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have propelled the first comprehensive redesign of the silicon etch chamber in over a decade. The resulting Applied Centris Sym3 system delivers world-class cross-wafer uniformity with unprecedented within-chip feature control in critical etch applications for high-volume manufacturing at the 1x/10nm node and beyond.
Plus de 400 dirigeants participeront à cet événement riche en information. Il s’agit de cadres locaux et nationaux, des décideurs de premier plan actifs dans les domaines suivants : l’investissement, le développement, la gestion, la location, le financement et la commercialisation. Près de 50 % des participants proviennent de l’extérieur de la ville.
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